Give the people what they want: toward making 3D IC mainstream
Learn more about the five interconnected workflows that are democratizing next generation design in the emerging chiplet age.
DFM
Building confidence and flexibility in 3D-IC system level design
3D-IC presents major connectivity challenges in maintaining a golden netlist and managing necessary exceptions. Learn how to manage them.
A quick and easy way to calculate P2P resistance and current density
Coordinate-based checking provides a streamlined way to verify designs around ESD before full-chip runs without the need for custom checks.
Layout customization improves productivity in design and verification flows
What are the options and how do you balance overarching CAD requirements and personal preferences?
Siemens’ Sawicki puts priority on scaling in processes, productivity and systems
More optimistic about the semiconductor industries prospects than for some time, Siemens Joe Sawicki identified key EDA challenges at DAC.
How to optimize productivity and accuracy in IC design and verification flows
Pre- and post-processing EDA techniques help streamline design rule checks and delivery efficient waivers to speed design and debug.
Hit your tapeout schedules with in-design signoff DRC
Delivering physical implementations at new process nodes is getting ever harder. Learn how to stay on track by checking work is rule-compliant as you go.
Making sense of cloud EDA
How to carry out a sensible analysis of cloud EDA's potential, so you get the right tools and computational resources to deliver increasingly complex designs.
How you can decide what level of DRC you need when you need it
Using on-demand rule checks during place-and-route boosts efficiency and design quality.
Not using reliability check waivers? You’re wasting valuable time
Reliability rule checks need - and now get - more granular analysis that allows designers to adopt proposed waivers with much greater confidence.
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