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January 26, 2023
Give the people what they want: toward making 3D IC mainstream
Learn more about the five interconnected workflows that are democratizing next generation design in the emerging chiplet age.
Expert Insight | Topics:
IP - Design Management
,
EDA - DFM
,
DFT
,
IC Implementation
| Tags:
3D IC
,
architecture
,
chiplet
,
Design Management
,
methodology
,
multi-physics
| Organizations:
Siemens EDA
January 19, 2023
Putting it all together to accelerate 3D IC design
Learn how connectivity management solutions help you manage the multiple formats in which 3D IC components are delivered.
Article | Topics:
PCB - Design Integrity
,
- EDA Topics
,
EDA - IC Implementation
,
- PCB Topics
,
PCB - System Codesign
| Tags:
2.5D
,
3D
,
advanced packaging
,
chiplet
,
connectivity management
,
design integrity
,
Design Management
,
file format
,
interposer
| Organizations:
Siemens EDA
PCB Topics
Design Integrity
Layout & Routing
System Codesign
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