Chipmaker

June 8, 2015

CEA-Leti adds partners to FD-SOI low-power design centre

Silicon Impulse program adds partners to ease industrialisation of ultra-low power IC designs based on FD-SOI processes
Article  |  Topics: Blog - EDA  |  Tags: , ,   |  Organizations: , ,
June 8, 2015

Altera boosts density and pipelining in finFET FPGA shift

Altera is using a combination of Intel's 14nm process technology and multidie packaging to boost the logic-cell count for its FPGAs, together with a superpipelining strategy to help balance area and clock speed.
Article  |  Topics: Blog - EDA, PCB  |  Tags: , , , ,   |  Organizations:
June 8, 2015

Synopsys speeds automotive SoC qualification with IP launch

Synopsys develops portfolio of ASIL B ready IP, and invests in AEC-Q100 testing and TS 16949 quality management, to ease automotive SoC qualification.
Article  |  Topics: Blog - IP  |  Tags: , , , , , , ,   |  Organizations: , ,
June 8, 2015

S3 aims at MIMO WiFi with smaller ADC core

S3 Group has launched the second in a family of low-power successive-approximation ADCs, with a design that supports sample rates up to 320MS/s.
Article  |  Topics: Blog - IP  |  Tags: , , , , , ,   |  Organizations:
June 7, 2015

IBM plans to disrupt EDA market with cloud offering

IBM to offer end-to-end IC design flow on its own infrastructure in PAYG EDA model.
Article  |  Topics: Blog - EDA  |  Tags: , , ,   |  Organizations: ,
June 7, 2015

Docea adds API to model power software interactions

Docea Power has added a programming interface to the latest version of its Aceplorer power-modeling software to show how chipset designs would fare under a variety of software-based power-management algorithms.
Article  |  Topics: Blog - EDA, Embedded  |  Tags: , , , ,   |  Organizations:
June 5, 2015

SRAM IP “halves dynamic power” on 28nm FDSOI

Embedded SRAM IP said to reduce dynamic, static power on FDSOI at cost of extra 10% area
Article  |  Topics: Blog - IP  |  Tags: , ,   |  Organizations:
June 4, 2015

COMPUTEX 2015: Qualcomm edges Intel out of UK smartwatch start-up

Blocks' promo video says its work was 'Funded by Intel' but Qualcomm has announced that the modular watch company will be using its Snapdragon 400.
Article  |  Topics: Conferences, Blog - Embedded, PCB  |  Tags: , ,   |  Organizations: , ,
June 4, 2015

COMPUTEX 2015: Wrap 1 – Is ‘The Internet of Things’ that helpful an idea?

Everybody knows the words. Everybody has a different definition. Did calling the next big thing 'The Internet of Things' actually create a hindrance not a help?
June 4, 2015

COMPUTEX 2015: Taiwan and mainland China face off in IoT platforms

It wasn't just ARM and TSMC that launched a 55nm IoT platform this week. Across the Taiwan Strait, Brite and SMIC have unveiled a similar offering. The competition could tell us a lot about the IoT market's future.