Mentor’s 2015 Valley User2User is less than two weeks away
IoT-themed keynotes from Mentor's Wally Rhines and Qualcomm's Karim Arabi headline vendor's User2User conference on April 21.
Archives
Xmos brings programmable networking to Gigabit Ethernet
Xmos has launched a series of microcontrollers based on its timesliced multicore architecture that adds Gigabit Ethernet interfaces.
DAC 52 keynotes focus on body-worn electronics and vehicle design
The 2015 Design Automation Conference in San Francisco will feature keynotes that focus on body-worn electronics such as Google’s Smart Contact Lens and automotive issues.
TI uses Cortex-M4F to provide low-power 32bit upgrade for MSP430
Texas Instruments has launched a family of ARM-based microcontrollers intended to act as a migration path from its low-energy 16bit MSP430 series, developing its own flash-capable 90nm process to implement them.
Mentor unites chip-to-package flow with Xpedition Package Integrator
Flow draws on existing strengths in Xpedition, Valor, Nimbic and Flotherm among others to optimize 3D design projects and improve cross-disciplinary communication.
ARM and Cadence agree to share IP access
ARM and Cadence have signed a deal that provides the IP teams at both companies with access to each other's cores.
China’s foundry outlook improves but still much to do
Foundry veteran Simon Yang told Semicon China while things are looking up the country cannot count on ‘traditional’ methods or advantages if it's to be a major chipmaker.
Broadcom sees Chinese automotive as key to Internet of Things
Comms giant to seek out more local partnerships with China poised to account for a third of car sales with each new vehicle featuring 1,000 semis.
Synopsys claims finFET leadership
Synopsys claims its tools have enabled 90% of finFET designs currently going into volume production
Cadence reworks implementation for both finFET and older processes
Cadence Design Systems has coupled the parallel-processing techniques behind its recently launched sign-off tools to engines intended to deal with sub-28nm process issues in a suite that reworks the company’s key implementation tools.