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ARM has launched a 64bit processor core aimed at high-end mobile phones, coupled to a new graphics processor and cache-coherent interconnect.

Cadence Design Systems has added LPDDR4 support and a topology explorer to its Sigrity lineup for signal and power integrity analysis of PCB-based designs, as well as more flexible licensing options.

ARM has picked up TÜV Süd certification for a version of its C compiler and produced an ISO 26262 documentation pack for the Cortex-R5 processor

Research by the University of Michigan into subthreshold circuit design has led to spinoff company Ambiq Micro creating a family of microcontrollers that it claims provide an ARM Cortex-M4F with power consumption at levels normally associated with an M0+.

At IEDM 2014, CEA-Leti presented a technique that prevents damage to base-layer transistors in monolithic 3DIC processes. As work progresses, the institute is preparing to receive 3DIC designs in 2017.

The International Electron Device Meeting (IEDM) has once again provided a chance for the major chipmakers to go head-to-head with their latest processes - this time with finFETs.

Cadence has released a tool intended to ease the creation of scenario-driven tests to better exercise complex IP and SoC designs.

Canadian startup Invionics has launched a development environment and packager intended to make it easier for users within chipmakers and design houses to build customized tools.

TSMC says it has begun risk production on its FinFET Plus (16FF+) process, claiming that it has reached a greater level of maturity earlier in its development cycle than previous nodes developed at the foundry.

UK-based RAL Space has picked up an award from National Instruments for a system the organization built to test a pair of cameras ahead of being being deployed on the International Space Station to photograph the Earth from orbit.