ARM snaps up Carbon model IP for prototyping
ARM has moved back into system-level modelling with the decision to buy the tools and models developed by Carbon Design Systems
ARM has moved back into system-level modelling with the decision to buy the tools and models developed by Carbon Design Systems
Vendor adds verification support for 25G, 50G and 100G Ethernet through emulator-based virtualization.
…and why the semiconductor industry hasn’t been singularitied down to one MegaSemis Inc even if that’s what M&A data suggests.
IMEC and Cadence have taped out a test chip intended to explore key lithography and metal-interconnect issues that will face users of the forthcoming 5nm process node.
Tech Design Forum talked to the general and program chairs of DVCon Europe about the conference and how it seeks to show the expansion of IC verification methodologies to the system level.
Ceva has launched a software package intended to streamline the porting of convolutional neural network implementations to the XM4 DSP core.
Memory efficiency has driven the design of the latest video and image processor core developed by Cadence Tensilica.
Samsung bases PRISM and FLARE defect analysis and optimization on Mentor Graphics’ Calibre and Tessent. Yields rise. Ramps shorten.
A novel approach to 3D NAND will be among the presentations at the International Electron Device Meeting to be held in Washington, DC in December.
Stability is the watchword as AMS and MEMS specialist Tanner retains much of its independence – a ‘start-up with a billion-dollar company behind us’.