eSilicon to cut costs of ASIC development for IoT, other markets
Online portals enable ASIC designers to explore IP and delivery options, enabling lower-cost markets such as IoT
IP
Samsung certifies Synopsys tools, IP at 14nm
Samsung, Synopsys and ARM have been working together to create a finFET design ecosystem.
Synopsys uses virtual prototyping kits to kick start IP integration
Synopsys is porting its IP to a series of virtual prototyping kits in a plan to cut the amount of time that it takes to integrate new high-speed interfaces such as USB 3.0
IP takes center stage in push towards systems engineering
At DAC 2014, some 30 per cent of exhibitors are IP suppliers, offering design services or both, demonstrating how system-level design is about building on what has gone before.
Vorsprung durch 3D technik for Audi
The automotive sector could become one of the key markets for 3D integration according to the head of Audi's progressive semiconductor program.
Cadence signs with ARM for core optimizations
Cadence Design Systems has signed up for a licence to ARM cores that will let the EDA supplier optimize support for 32bit and 64bit Cortex processors in its tools.
Cadence ports IP and qualifies tools for 28nm FD-SOI
Cadence Design Systems has developed two sets of IP aimed at the 28nm FD-SOI process developed by STMicroelectronics and qualified tools for the process.
Altera finds a way to cheaper floating point in FPGAs
Altera has revealed that the DSP blocks in the Arria 10 FPGAs contain the logic needed to make them work as IEEE754-compliant floating-point units.
DAC 2014 offers free exhibit entry for three days
The 51st Design Automation Conference, to be held in San Francisco in early June, is offering free exhibit floor entry for the full three days.
Conference demonstrator brings printed-electronics suppliers together
For its Printed Electronics conference, IDTechEx pulled together a team together with P&G to develop a collaborative demonstration of the technology.