EDA Topics

July 15, 2014

Parasitic extraction

Parasitic extraction reveals the impact of implementation on the theoretical performance of IC designs.
July 13, 2014
ST/CEA-Leti 'Frisbee' wide-voltage DSP

DVFS and body bias

Dynamic voltage and frequency scaling is effective for low-power VLSI design. Body or back bias can provide additional control over leakage and performance.
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July 9, 2014
Intel's trigate is among the structures to be modeled by the revised BSIM4

One BSIM to rule them all

A change in the way the core compact models are developed has accelerated their development and, for the first time, allowed the models to be used not just for circuit simulation but to help guide process evolution as chipmakers play not only with materials but the shape of finFETs.
July 3, 2014
Pranav Ashar

It’s time to embrace objective-driven verification

How Wall Street's vastly resourced IT teams already point the way to cheaper, faster and more efficient verification by putting goals not tools first.
June 30, 2014
Future of thermal simulation

The future of thermal simulation for electronics products

Complexity and the increasing use of thermal analysis software by non-expert designers demands new approaches for chip and PCB implementations.
June 27, 2014

How to use PCI Express in low-power mobile SoCs by exploiting M-PCIe

How to use PCIe in low-power SoCs by swapping the standard PCIe PHY for M-PCIe, defined by MIPI for mobile use
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June 22, 2014
Preview image for monolithic 3D integration

Monolithic 3DIC for SoC

Monolithic 3DIC integration may provide a viable alternative to conventional 2D scaling for SoCs if manufacturing problems can be overcome.
June 18, 2014
Parasitic Extraction Featured Image

Full 3D-IC parasitic extraction

How to enhance an 'ideal' parastitic extraction strategy to create a full 3D assembly-level parasitic netlist for simulation and circuit analysis.
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June 15, 2014
Chips on a wafer

Early tape-out: smart verification or expensive mistake?

Is it worth trying to iron out all the bugs in an SoC before taping out, or should design teams anticipating a re-spin go to silicon earlier and use the chips that come back as verification accelerators?
June 10, 2014
High-speed I/O eye diagram - thumbnail

Zeroing in on the problems of fast board-level interconnect

A panel session at DAC 2014 focused on the problems of high-speed, board-level interconnect and the roles of codesign and power integrity in solving them.