November 30, 2023
The Boundary Condition Independent Reduced Order Model (BCI-ROM) provides vital help in addressing growing electro-thermal challenges in SPICE simulation.
June 13, 2017
German consultancy E-Cooling describes its strategy for thermal and airflow analysis.
May 8, 2017
Our extended fireside chat with Mentor Chairman and CEO Wally Rhines begins by canvassing his thoughts now the Siemens deal is done.
December 29, 2016
Reliability is growing to match security as a key challenge for PCB design. These tools and techniques will help you rise to it.
September 28, 2016
Keeping noise levels down was one of the priorities for two companies working independently on configurable power supplies – but without compromising DFM and thermal performance.
June 30, 2014
Complexity and the increasing use of thermal analysis software by non-expert designers demands new approaches for chip and PCB implementations.
November 1, 2008
Floorplanning informed by thermal analysis can significantly improve PCB layouts, writes Robin Bornoff The number of PCB design constraints seems ever increasing. The risk that a design will fail either functional performance or reliability goals grows for each generation. One increasingly popular trade-off addresses a balance between thermal compliance and signal integrity. Components with high […]