Semiconductor devices are being fabricated with features that are less than half the wavelength of the available lithography exposure tools. Increasing circuit density has improved the complexity and performance of ICs but also led to serious patterning proximity effects. These effects make the chips almost impossible to fabricate without optical proximity correction (OPC) technology. Thus, […]
Major yield-Inhibiting Issues At each successive process node, additional defect mechanisms appear and hinder the ability to achieve desired yield (Figure 1). The trend toward declining yields has led to a resurgence in the application of design for manufacturing (DFM) methodologies.Much of this reinvigorated effort relies heavily on a new breed of tools and technologies. […]
The network-on-chip (NoC) design paradigm is seen as a way of enabling the integration of an exceedingly high number of computational and storage blocks in a single chip. But its adoption and practical implementation face important and unsolved issues related to design methodologies, test strategies, and dedicated CAD tools. The System-on-a-Chip Research Lab at the […]
