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Dr Chenming Hu joins Mentor CEO Wally Rhines and Xilinx SVP Victor Peng to keynote free day-long User2User in San Jose on April 25th, capping a full technical program.

US defense research agency DARPA sets targets for cooling overall systems and hot spots in stacked silicon, and backs joint research from Rockwell-Collins and Georgia Tech.

Two vendors have announced early adopter software implementations of the new video compression standard that promises an up to 50% bandwidth cut against H.264.

In the first of our weekly DAC 2013 previews, we discuss program highlights with general chair Yervant Zorian, including an expanded Designer Track, keynotes and golden jubilee celebrations.

With an April release date promised, we should soon have confirmation on the new processor and price tag for the stripped down embedded Linux development board.

With both now more dependent on foundry business for their finFET (trigate) and FDSOI offerings, DATE was a chance to push their innovations in low power.

ARM CPU chief proposes 'unit of compute' as building block for energy-efficient computation systems

Docea Power extends power and thermal analysis tools to address complexity and sub-dividing responsibilities among architects.

Leading vendors and users spoke of the challenges in developing today's SoCs when faced with a plethora of prototyping techniques - and the challenges that remain.

The Internet of Things will drive the next phase for MEMS, greatly helped by a change in the way that the mobile phone interacts with its environment, says Benedetto Vigna of STMicroelectronics.