Archives

November 30, 2023

Benchmarking the maturity of AI in EDA

Solido discusses how it has leveraged AI for SPICE level efficiency and the benchmarks it has used.
November 22, 2023

Arm gives Helium to low-end Cortex-M core

Arm has added machine-learning extensions and pointer-security instructions to its latest Cortex-M series core.
Article  |  Topics: Blog - Embedded, IP  |  Tags: , , , ,   |  Organizations:
November 20, 2023

ETRI builds flow for AI chiplets

South Korea's leading research institute has built a reusable flow for lower power petaflops-performance AI.
Article  |  Topics: Blog - EDA, - HPC, Next Generation Design, Packaging, Verification  |  Tags: , , ,   |  Organizations: , ,
November 17, 2023

Siemens takes automotive digital twin to the AWS cloud

Siemens has made its PAVE360 automotive digital-twin software available on AWS, with the ability to access fast Arm models on the same cloud.
Article  |  Topics: Blog - EDA, Embedded  |  Tags: , , , ,   |  Organizations: , ,
November 15, 2023

Siemens buys Insight for reliability addition to Calibre

Siemens has completed the acquisition of Insight EDA, a specialist in circuit-reliability analysis.
Article  |  Topics: Blog - EDA  |  Tags: , , , , ,   |  Organizations:
November 14, 2023

Imec makes virtual fab public for green analysis

Imec has a version of its imec.netzero virtual fab tool accessible to the general public with the aim of showing the environmental impact of IC manufacturing.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , ,   |  Organizations:
November 6, 2023

Cadence combines ML techniques for power signoff

Cadence has linked several machine-learning approaches to build a tool that is designed to speed up the detection and diagnosis of on-chip power-integrity issues.
Article  |  Topics: Blog - EDA  |  Tags: , , ,   |  Organizations:
November 3, 2023

Codasip pips Arm to commercial CHERI with RISC-V version

Codasip has put support for a set of instruction extensions intended to secure memory into its RISC-V core designs.
November 2, 2023

X-Fab adds galvanic isolation to CMOS process

X-Fab has made it possible to put galvanic isolation based on capacitive coupling directly into chips made on its XA035 process.
Article  |  Topics: Blog - IP  |  Tags: , , , , ,   |  Organizations:
November 1, 2023

Companies partner for embeddable ReRAM

SureCore and Intrinsic have teamed up to provide a way to implement resistive random-access memory as an SoC-embeddable technology.
Article  |  Topics: Blog - IP  |  Tags: , ,   |  Organizations: