Author Archives: Chris Edwards

About Chris Edwards

Chris Edwards has spent a long time covering electronics and EDA. He is a former Editor-in-Chief of Electronic Engineering Times UK and electronics editor of the IET's Engineering & Technology. His work has appeared in a variety of international newspapers including The Guardian, The Daily Telegraph, The Age and the South China Morning Post.
February 14, 2017

Microsemi takes flash FPGAs to 28nm

Microsemi has launched a family of non-volatile FPGAs that use a 28nm process to increase density over the previous SmartFusion devices.
Article  |  Topics: Blog - Embedded, PCB  |  Tags: , , ,   |  Organizations:
February 3, 2017

Penetration test tools extend reach into embedded devices

The Metasploit collection of tools used by penetration testers to find security flaws in software now has a bridge to deeply embedded hardware devices, developed by analytics company Rapid7.
January 23, 2017

EU group claims it’s “time to reinvent computing”

A report put together by the European Union's Hipeac embedded architecture research network claims the challenges of highly interconnected embedded systems will call for what amounts to the reinvention of computing.
Article  |  Topics: Blog - Embedded  |  Tags: , , ,
January 18, 2017

Wafer expansion hits the buffers

What's old is new: 200mm wafers are returning and driving shortages while 450mm fades into the distance.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , ,   |  Organizations: ,
January 9, 2017

VLSI Symposia issue calls for papers

Online paper submissions are now open for the 2017 Symposia on VLSI Technology and Circuits.
Article  |  Topics: Blog - EDA, IP  |  Tags: , ,   |  Organizations:
December 15, 2016

Benchmark effort to look at IoT security performance

EEMBC has launched a benchmarking effort to test the performance of security and crypto-functions on embedded devices.
Article  |  Topics: Blog - Embedded  |  Tags: , ,   |  Organizations:
December 12, 2016

IEDM explores faces of 3D monolithic integration

What will 3D integration look like? IEDM 2016 explored some of the options ranging from IoT sensors to advanced logic.
Article  |  Topics: Blog Topics  |  Tags: , , ,   |  Organizations:
December 7, 2016

IMEC stacks nanowire transistors together on CMOS

IMEC has claimed at IEDM to have implemented for the first time the CMOS integration of vertically stacked nanowire transistors.
Article  |  Topics: Blog - EDA  |  Tags: , ,   |  Organizations:
December 7, 2016

HiSilicon licenses onchip debug engine for SOCs

HiSilicon has licensed UltraSoC’s semiconductor IP to build into SoCs for system monitoring, analysis, and optimization.
Article  |  Topics: Blog - IP  |  Tags: , , ,   |  Organizations: ,
December 6, 2016

Security group publishes first guidelines

The UK's IoT Security Foundation has published the first set of documents intended to provide best-practice guidelines for developers of embedded systems.
Article  |  Topics: Blog - Embedded  |  Tags: ,