Blog Topics

April 17, 2019

ES Design West aims to showcase EDA to a widening world

ES Design West holds its first edition at San Francisco's Moscone Center colocated with SEMICON West in July.
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April 16, 2019

Boost your DFT efficiency for AI silicon design

Three hierarchical DFT strategies help cut time-to-market for large AI chips by exploiting regularity and addressing test at the RTL.
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April 12, 2019

DesignWare gets automotive boost with GLOBALFOUNDRIES 22FDX SOI qualification

Synopsys and GLOBALFOUNDRIES are developing a portfolio of automotive IP for the chipmaker’s 22nm fully depleted silicon-on-insulator (22FDX) process.
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April 9, 2019

DAC announces first set of keynotes for 2019

Electronic musician Thomas Dolby will be among the keynote speakers at the 56th Design Automation Conference (DAC) in Las Vegas.
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April 4, 2019

ODSA weighs options for chiplet interconnect

An Open Compute Project group working on multichip integration sees a combination of parallel and serial interfaces being important for interchip communication.
April 3, 2019

DVCon China 2019 preview: Breker Verification Systems

Breker CEO Adnan Hamid will lead a tutorial on the Portable Stimulus Standard as part of the verification specialist's activities in Shanghai.
April 3, 2019

DVCon China 2019 preview: OneSpin

The verification specialist will address the challenges posed by billion-gate SoCs and the integration of formal and simulation in its presentations.
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April 2, 2019

Cadence presents plan for piecemeal cloud compute

Cadence has launched a web-based EDA service the company hopes will ease the transition from self-hosted computing to more flexible cloud-based development.
April 2, 2019

DVCon China 2019 preview: SmartDV

RISC-V VIP offerings headline the verification specialist’s presence in Shanghai later this month.
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April 2, 2019

Catapult HLS integrates eFPGA IP for faster development

Menta eFPGA IP is highly configurable making it well suited to the evolving designs that exploit HLS abstraction.
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