IC Implementation

September 14, 2017
Featured image - Silicon photonics

Silicon photonics moves out of the shadows

An alphabet soup of AI, HPC, 5G and the IoT has finally seeded creation of a design infrastructure for silicon photonics.
September 8, 2017

How HLS is giving shape to glasses-free 3DTV

High level synthesis (HLS) was adopted to realize innovative display IP as developed by a small core engineering team.
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May 8, 2017
Dr Walden Rhines is Chairman and CEO of Mentor - A Siemens Business

The Wally Rhines interview – Part One: Mentor as a Siemens business

Our extended fireside chat with Mentor Chairman and CEO Wally Rhines begins by canvassing his thoughts now the Siemens deal is done.
March 15, 2017
DVCon China takes place at the Parkyard Hotel, Shanghai on April 19th.

DVCon China launches this April in Shanghai

DVCon China general chair Andy Liu discusses Accellera’s new addition to its design and verification conference series (简体中文).
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January 27, 2017
Richard Pugh featured image SSD expert insight

The SSD memory revolution

Richard Pugh looks at how innovations highlighted during the recent International Memory Workshop are driving the solid state drive (SSD) market.
December 9, 2016
Featured image - analog design constraints

A new path for analog design constraints verification

Traditional techniques are being challenged by shortening design cycles and the effects of later process nodes.
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December 2, 2016

Hierarchical signoff of SoC designs at advanced process nodes

Hierarchical signoff strategies for large SoCs at advanced nodes can be effective if sufficient attention is paid to reflecting the impact of cross-hierarchy parasitics.
November 29, 2016
Ken Brock, product marketing manager, Synopsys

Six ways to exploit the advantages of finFETs

FinFET processes and libraries are maturing, enabling designers to explore the best ways to take advantage of the capabilities of the new transistor design
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October 3, 2016
Dr Walden Rhines is Chairman and CEO of Mentor - A Siemens Business

Wally Rhines separates the signal from the noise

Mentor's chairman and CEO has dug into why chip sales forecasts often miss the target and suggests some tools for assessing the Internet of Things.
October 3, 2016
Place and route beyond 10nm

How place and route is adapting to challenges below 10nm

Multi-patterning, finFETs and more are forcing more detailed overhauls of P&R software at each process node. We dig into some of the key new issues and how they are being addressed.

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