IC Implementation

How to work with multiple levels of physical hierarchy when floorplanning multicore, multiport, multi-million gate SoCs

Advances in RTL floorplanning help cut front-to-back-end iterations, speed synthesis by 10X and boast the capacity needed for today's designs.

Using triple modular redundancy, error detection and correction, and 'safe' FSMs to ensure greater functional safety in FPGA-based designs

Dr Walden Rhines, Mentor Graphics chairman and CEO, looks forward to the trends that will shape 2016 in the semiconductor industry.

The 10nm process node calls for the use of SOCV techniques during timing signoff to avoid leaving too much performance on the table.

The arrival of the 10nm process will impact the way that designers approach custom and mixed-signal layout. Cadence Design Systems has made changes to its Virtuoso environment that deploy increased automation support and electrically-aware layout to deal with the upcoming issues.

The 10nm process will see changes to multiple patterning that demands changes in the implementation flow, along with an increased focus on the effects of variability.

Part three of our series looks at the choices you face as you decide whether to build or buy a board.

Part two of our series on FPGA-based prototyping looks at two critical factors to address before a project begins: budgeting and high-level implementation.

AMD's Radeon R9 family is the result of eight years developing 3D-IC and interposer technology. What lessons did the company learn?