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January 19, 2023
Putting it all together to accelerate 3D IC design
Learn how connectivity management solutions help you manage the multiple formats in which 3D IC components are delivered.
Article | Topics:
PCB - Design Integrity
,
- EDA Topics
,
EDA - IC Implementation
,
- PCB Topics
,
PCB - System Codesign
| Tags:
2.5D
,
3D
,
advanced packaging
,
chiplet
,
connectivity management
,
design integrity
,
Design Management
,
file format
,
interposer
| Organizations:
Siemens EDA
May 31, 2018
Layout-database file control: the missing link
The authors descirbe a new signature-based approach to resolving the content of layouts in GDSII, OASIS and other formats.
Article | Topics:
EDA - DFM
,
IC Implementation
| Tags:
database format
,
file format
,
GDSII
,
layout
,
MEBES
,
Oasis
,
OASIS.MASK
| Organizations:
XYALIS
EDA Topics
DFM
DFT
ESL
IC Implementation
Verification
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