IC Implementation

The arrival of the 10nm process will impact the way that designers approach custom and mixed-signal layout. Cadence Design Systems has made changes to its Virtuoso environment that deploy increased automation support and electrically-aware layout to deal with the upcoming issues.

The 10nm process will see changes to multiple patterning that demands changes in the implementation flow, along with an increased focus on the effects of variability.

Part three of our series looks at the choices you face as you decide whether to build or buy a board.

Part two of our series on FPGA-based prototyping looks at two critical factors to address before a project begins: budgeting and high-level implementation.

AMD's Radeon R9 family is the result of eight years developing 3D-IC and interposer technology. What lessons did the company learn?

This multi-part series addresses various aspects of FPGA-based prototyping. Future installments will address budgeting and implementation, but we start by looking at why the technique is generating so much interest.

The wearables market is booming. Successful development depends on assembling the right software and hardware tools. Here's a primer on what to look for.

In sessions at the 2015 Design Automation Conference, engineers who had worked on finFET-oriented projects revealed how the technology has changed their design practices and where others may want to think twice about making the move.

Clock-tree generation is coming under increased scrutiny because of its role in dynamic power consumption and problems caused by on-chip PVT variation.

FinFETs present a number of problems with respect to dynamic power consumption. Design techniques are being re-evaluated to deal with the issue.