IC Implementation

Part two of our series on FPGA-based prototyping looks at two critical factors to address before a project begins: budgeting and high-level implementation.

AMD's Radeon R9 family is the result of eight years developing 3D-IC and interposer technology. What lessons did the company learn?

This multi-part series addresses various aspects of FPGA-based prototyping. Future installments will address budgeting and implementation, but we start by looking at why the technique is generating so much interest.

The wearables market is booming. Successful development depends on assembling the right software and hardware tools. Here's a primer on what to look for.

In sessions at the 2015 Design Automation Conference, engineers who had worked on finFET-oriented projects revealed how the technology has changed their design practices and where others may want to think twice about making the move.

Clock-tree generation is coming under increased scrutiny because of its role in dynamic power consumption and problems caused by on-chip PVT variation.

FinFETs present a number of problems with respect to dynamic power consumption. Design techniques are being re-evaluated to deal with the issue.

Emulation is now served by all three leading vendors and is a hot topic for discussion among engineers. The major verification conferences need to follow suit.

Designers working on automotive ICs, to be built on established processes, can benefit from the power of design tools developed for advanced processes.

Precise curved geometries are vital to making this emerging and cost-effective CMOS-based technology work. This primer explains its advantages and how litho tools are evolving to meet the challenges it presents.