lithography hotspot analysis

A new technique has been developed to catch potential new lithography issues when little design data is available for incoming nodes.

Pattern-based design/technology co-optimization (DTCO) estimates lithographic difficulty during the early stages of a new process technology node.

Sign-off lithography verification is vital as we move beyond double to multi-patterning but changing responsibilities in the flow must be handed with care.

Lithography is only just beginning to play a role in cell IP selection but early analysis already matters.

By the time a serious lithography-related problem is identified at the fab, it is too late in the design process to make simple layout changes. To avoid or reduce design delays, Infineon Technologies uses lithography simulation to detect weak points in a layout and analyze the effect of lithography on the design’s electrical performance. Its [...]

DRC+ is a new methodology that algorithmically characterizes design variation through pattern classification. A traditional design rule is used to identify all design structures that share a common configuration. Then, the 2D geometric situations (pattern variations) around the configuration are extracted and classified. Since all such classes share a common configuration, each situation class represents [...]

The article offers a case study of the DFM planning and methodology applied during a shrink of Cambridge Silicon Radio's UF6000 system-on-chip from the 130nm to 65nm.

DFM is essential to differentiating your products in the market, says Luigi Capodieci