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ARM and Cadence have signed a deal that provides the IP teams at both companies with access to each other's cores.

Foundry veteran Simon Yang told Semicon China while things are looking up the country cannot count on ‘traditional’ methods or advantages if it's to be a major chipmaker.

Comms giant to seek out more local partnerships with China poised to account for a third of car sales with each new vehicle featuring 1,000 semis.

The FD-SOI technology developed by CEA-Leti and STMicroelectronics is beginning to gain ground as chipmakers investigate the process as a way to deliver low-energy, wireless-capable SoCs.

As plans crystallize to take FD-SOI down to 10nm, CEA-Leti argues that the technology can provide an alternative path to that of finFETs to get to 7nm processes and beyond.

Synopsys claims its tools have enabled 90% of finFET designs currently going into volume production

Cadence Design Systems has coupled the parallel-processing techniques behind its recently launched sign-off tools to engines intended to deal with sub-28nm process issues in a suite that reworks the company’s key implementation tools.

'Bling' for fashionistas and the B Ark lot. Apple Watch limps as the S1 SIP fails to offer convincing battery life. Silicon shortfall still dogs wearables.

The Embedded Microprocessor Benchmark Consortium (EEMBC) has released a benchmark suite aimed at applications processors and higher-performance microcontrollers with floating-point units.

Unsettled by attacks on embedded devices such as the point-of-sale terminals used by retailers such as Target and the potential for hackers to target critical infrastructure, the industry focused squarely on security at this year’s Embedded World in Nürnberg, Germany.