Gary Smith EDA: PCB ‘a door to the future’ but ‘slow take-off’ for ESL
The leading EDA analyst also charts growth for RTL and IC CAD in 2014 Market Share Summary, and highlights system-driven shifts in tool evaluation.
MEMS
DATE: Mobile phone to drive Internet of Things MEMS wave
The Internet of Things will drive the next phase for MEMS, greatly helped by a change in the way that the mobile phone interacts with its environment, says Benedetto Vigna of STMicroelectronics.
Germanium finFETs, TFETs and MEMS modelled at IEDM
The modelling track at IEDM 2012 showed how germanium could be used in 14nm finFETs. Other work focused on tunnel FETs and analyzing MEMS using Spice.
ISQED focuses on systems, education and sensors
The International Symposium on Quality Electronic Design (ISQED) enters its 13th edition later this month, running March 19-21 at Techmart in Santa Clara. Although ISQED traditionally concentrated on tools and IP blocks, its agenda has broadened as the industry has migrated to SoCs and full electronic systems where process and manufacturing interactions have come to […]
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