Siemens pulls supply-chain data into Xpedition
Siemens is integrating the Supplyframe platform with the Xpedition PCB-design software to give engineers better visibility into component availability.
Tech Design Forum Briefing
Briefing Authors
Paul Dempsey
Paul Dempsey has been a technology journalist for 20 years. His work has also appeared in EETimes, Red Herring and specialist journals published by the Financial Times.
Luke Collins
Luke Collins is a freelance technology journalist with 22 years’ experience. He is a former Editor-in-Chief of Electronics Times in the UK, and co-founded the IP9x series of conferences.
Chris Edwards
Chris Edwards has spent two decades covering electronics and EDA. He is a former Editor-in-Chief of Electronic Engineering Times UK and electronics editor of the IET's Engineering & Technology.
Air-filled waveguides to cut losses in mass-market radar
AT&S and Imec partnered to develop a way of putting low-loss waveguides into conventional PCBs to support D-band automotive radar and 6G modules.
Does 2.5DIC call for IC design tools for the packaging?
Siemens has published a white paper that examines whether package designers need to adopt IC tools and design styles in the move from organic packages to 2.5DIC packages.
Semidynamics adds flexible vectors to RISC-V cores
Semidynamics has released a customizable vector unit with out-of-order execution support to accompany its 64bit RISC-V processor cores.
X-Fab introduces BCD-on-SOI at 110nm
X-Fab Silicon Foundries claims to be the first with a foundry offering for 110nm BCD-on-SOI technology, aimed primarily at automotive designers.
Charting the path for machine learning in functional verification
A comprehensive review of ML’s potential and its current use identifies challenges ahead.
UK projects builds models for quantum computer controls
Partners in the UK’s CryoCMOS Consortium have developed models that are expected to help deliver CMOS chips that will work inside cryostats.
Alps Alpine composes capacitance IC with Symphony
The company says the mixed-signal platform enabled a 5X improvement in verification productivity.
Achieving functional coverage of multi-language designs
There is no comprehensive standard yet for functional coverage across designs using SystemC, TLM, UVM and SystemVerilog, but there are options using UVM Connect.
Semidynamics pushes configurability on RISC-V core for HPC
Processor IP company will incorporate custom instructions and other changes in its superscalar core, which includes a novel memory unit for sparse matrices.