Tech Design Forum Briefing


Briefing Authors

Paul Dempsey

Paul Dempsey Paul Dempsey has been a technology journalist for 20 years. His work has also appeared in EETimes, Red Herring and specialist journals published by the Financial Times.

Luke Collins

Luke Collins Luke Collins is a freelance technology journalist with 22 years’ experience. He is a former Editor-in-Chief of Electronics Times in the UK, and co-founded the IP9x series of conferences.

Chris Edwards

Chris Edwards Chris Edwards has spent two decades covering electronics and EDA. He is a former Editor-in-Chief of Electronic Engineering Times UK and electronics editor of the IET's Engineering & Technology.
May 31, 2022

Imagination brings in lower-cost access for accelerator IP

Imagination Technologies has dropped the requirement to take an upfront licence for some of its IP cores if customers join its Open Access program.

May 25, 2022

Siemens brings ReadyStart RTOS to RISC-V

Siemens has expanded its Nucleus ReadyStart program to the RISC-V architecture.

May 24, 2022

Saber models aim for ADI power chips

Synopsys and Analog Devices have agreed to provide model libraries for the chipmaker’s DC/DC ICs and power regulators that work with the Saber simulation tool.

May 23, 2022

IEDM to celebrate 75 years of the transistor

Recognizing the 75th anniversary of the transistor in December, the 68th IEDM has taken on the theme of looking at “transformative devices to address global challenges”.

May 12, 2022

Extended coverage for sign-off analysis

Real Intent has extended the fault coverage of its Meridian DFT static sign-off tool with improvements to the reporting of issues and the ability to track down root causes.

May 5, 2022

DAC returns to SF for in-person event

DAC returns to San Francisco in July for its 59th year as a purely in-person event.

April 29, 2022

Navigate variables and lifetimes in SystemVerilog

Variable lifetimes are an apparently basic but also tricky feature within the verification language.

April 28, 2022

DVCon Europe returns to live format

DVCon Europe will be held as a live event in Munich in early December.

April 28, 2022

Go inside proposals for common chiplet models

Chiplets will need models to guarantee heterogenous SiP implementation. A cross-industry working group describes its progress so far.

April 27, 2022

Verifying the new namespace storage options in NVMe 2.0

The NVMe 2.0 specification has introduced two namespace options that boost SSD performance while optimizing storage life.

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