Tech Design Forum Briefing


Briefing Authors

Paul Dempsey

Paul Dempsey Paul Dempsey has been a technology journalist for 20 years. His work has also appeared in EETimes, Red Herring and specialist journals published by the Financial Times.

Luke Collins

Luke Collins Luke Collins is a freelance technology journalist with 22 years’ experience. He is a former Editor-in-Chief of Electronics Times in the UK, and co-founded the IP9x series of conferences.

Chris Edwards

Chris Edwards Chris Edwards has spent two decades covering electronics and EDA. He is a former Editor-in-Chief of Electronic Engineering Times UK and electronics editor of the IET's Engineering & Technology.
July 11, 2023

AI’s possible roles in verification covered at VF2023

The recent Verification Futures Europe conference looked at what AI, from decision trees to foundation models, could do to speed up RTL checks.

July 10, 2023

Calibre ‘shifts left’ into place and route

Calibre Design Enhancer moves physical verification checks and automated DRC-clean via and cell insertion into P&R

July 10, 2023

Siemens fuels custom IC flows with artificial intelligence

Three fast developing AI techniques underpin the efficiencies in the new Solido custom design and verification platform.

July 7, 2023

UK consortium tapes out cryo-SRAM

A UK cryogenic-CMOS research project has taped out its first demonstrator chip for core memory IP expected to be able to operate at close to absolute zero.

July 4, 2023

Co-design underpins infrastructure acceleration at Google

At the recent VLSI Symposium, Google vice president Parthasarathy Ranganathan described the importance of co-design and the software stack in its data-center designs.

June 22, 2023

IEDM looks for leading devices for upcoming conference

The 69th annual IEEE IEDM has issued a call for papers seeking the world’s best original work in all areas of microelectronics research and development.

June 20, 2023

Maximize manufacturing execution with HPC

Single-device tracking in the chiplet and multi-chip age needs a boost to deliver accuracy and greater production efficiency.

June 14, 2023

Siemens pulls supply-chain data into Xpedition

Siemens is integrating the Supplyframe platform with the Xpedition PCB-design software to give engineers better visibility into component availability.

June 12, 2023

Air-filled waveguides to cut losses in mass-market radar

AT&S and Imec partnered to develop a way of putting low-loss waveguides into conventional PCBs to support D-band automotive radar and 6G modules.

June 1, 2023

Does 2.5DIC call for IC design tools for the packaging?

Siemens has published a white paper that examines whether package designers need to adopt IC tools and design styles in the move from organic packages to 2.5DIC packages.

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