AI’s possible roles in verification covered at VF2023
The recent Verification Futures Europe conference looked at what AI, from decision trees to foundation models, could do to speed up RTL checks.
Tech Design Forum Briefing
Briefing Authors
Paul Dempsey
Paul Dempsey has been a technology journalist for 20 years. His work has also appeared in EETimes, Red Herring and specialist journals published by the Financial Times.
Luke Collins
Luke Collins is a freelance technology journalist with 22 years’ experience. He is a former Editor-in-Chief of Electronics Times in the UK, and co-founded the IP9x series of conferences.
Chris Edwards
Chris Edwards has spent two decades covering electronics and EDA. He is a former Editor-in-Chief of Electronic Engineering Times UK and electronics editor of the IET's Engineering & Technology.
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Siemens fuels custom IC flows with artificial intelligence
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UK consortium tapes out cryo-SRAM
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Co-design underpins infrastructure acceleration at Google
At the recent VLSI Symposium, Google vice president Parthasarathy Ranganathan described the importance of co-design and the software stack in its data-center designs.
IEDM looks for leading devices for upcoming conference
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Maximize manufacturing execution with HPC
Single-device tracking in the chiplet and multi-chip age needs a boost to deliver accuracy and greater production efficiency.
Siemens pulls supply-chain data into Xpedition
Siemens is integrating the Supplyframe platform with the Xpedition PCB-design software to give engineers better visibility into component availability.
Air-filled waveguides to cut losses in mass-market radar
AT&S and Imec partnered to develop a way of putting low-loss waveguides into conventional PCBs to support D-band automotive radar and 6G modules.
Does 2.5DIC call for IC design tools for the packaging?
Siemens has published a white paper that examines whether package designers need to adopt IC tools and design styles in the move from organic packages to 2.5DIC packages.
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