Tech Design Forum Briefing


Briefing Authors

Paul Dempsey

Paul Dempsey Paul Dempsey has been a technology journalist for 20 years. His work has also appeared in EETimes, Red Herring and specialist journals published by the Financial Times.

Luke Collins

Luke Collins Luke Collins is a freelance technology journalist with 22 years’ experience. He is a former Editor-in-Chief of Electronics Times in the UK, and co-founded the IP9x series of conferences.

Chris Edwards

Chris Edwards Chris Edwards has spent two decades covering electronics and EDA. He is a former Editor-in-Chief of Electronic Engineering Times UK and electronics editor of the IET's Engineering & Technology.
April 2, 2019

DVCon China 2019 preview: SmartDV

RISC-V VIP offerings headline the verification specialist’s presence in Shanghai later this month.

April 2, 2019

Catapult HLS integrates eFPGA IP for faster development

Menta eFPGA IP is highly configurable making it well suited to the evolving designs that exploit HLS abstraction.

March 27, 2019

DVCon China 2019 preview: Mentor

Siemens PLM strategy VP Stefan Jockusch will keynote on digital twins in the automotive sector at next month’s conference in Shanghai.

March 26, 2019

Flexible PCB stretches across UAV’s wings for lower weight

UK-based Trackwise has shipped what could easily be the longest ever flexible PCB with a 26m-long substrate to deliver power and control to a UAV’s wings.

March 26, 2019

DVCon Europe looks to software in call for papers

DVCon Europe has added embedded software, digital twin, machine learning, and RISC-V to the topics the conference organizers want to cover.

March 26, 2019

UVM Cookbook released in new edition

Popular Verification Academy manual revamped and updated to bring it more closely in line with IEEE 1800.2 UVM and reflect the increasing use of emulation.

March 20, 2019

Microsoft offers free RTL for fast server compression

Not only has Microsoft decided to make a compression algorithm intended for data centers open source, the company the company is providing its own RTL to anyone who wants to implement it in silicon.

March 18, 2019

PCI may provide key to OCP chiplet standard

The ODSA Workgroup formed by Netronome and others is looking to adopt the PIPE standard for interconnecting chiplets as it starts work on a proof-of-concept module.

March 15, 2019

ES Design West registration opens

Registration has opened for the first ES Design West exhibition, which takes place alongside Semicon West in San Francisco in July.

March 12, 2019

Free registration opens for DAC

The Design Automation Conference (DAC) has kicked off free registration for the exhibit floor at early June’s Las Vegas event.

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