Blog Topics

Dr Chenming Hu joins Mentor CEO Wally Rhines and Xilinx SVP Victor Peng to keynote free day-long User2User in San Jose on April 25th, capping a full technical program.

Scale-out computing has demands so different from conventional applications that it could reshape the way to design one class of multicore processors.

US defense research agency DARPA sets targets for cooling overall systems and hot spots in stacked silicon, and backs joint research from Rockwell-Collins and Georgia Tech.

Two vendors have announced early adopter software implementations of the new video compression standard that promises an up to 50% bandwidth cut against H.264.

The device modeling specialist has integrated its new NanoSpice simulator with existing capture and analysis tools in a broad design-for-yield package.

At DATE 2013, Synopsys senior vice president Antun Domic, described how techniques for the latest nodes are being rolled back into mature nodes, all the way to 180nm.

FinFETs, ever proliferating verification, 3DIC, security and more feature on our guide to some of the most intriguing panels at DAC 2013.

Accellera Systems Initiative has created a working group to look at one of the knottiest problems in IC design: to simplify the job of checking designs when the bits come from so many sources and use languages that were not built for interoperability.

In the first of our weekly DAC 2013 previews, we discuss program highlights with general chair Yervant Zorian, including an expanded Designer Track, keynotes and golden jubilee celebrations.

With an April release date promised, we should soon have confirmation on the new processor and price tag for the stripped down embedded Linux development board.