Tech Design Forum Briefing


Briefing Authors

Paul Dempsey

Paul Dempsey Paul Dempsey has been a technology journalist for 20 years. His work has also appeared in EETimes, Red Herring and specialist journals published by the Financial Times.

Luke Collins

Luke Collins Luke Collins is a freelance technology journalist with 22 years’ experience. He is a former Editor-in-Chief of Electronics Times in the UK, and co-founded the IP9x series of conferences.

Chris Edwards

Chris Edwards Chris Edwards has spent two decades covering electronics and EDA. He is a former Editor-in-Chief of Electronic Engineering Times UK and electronics editor of the IET's Engineering & Technology.
March 13, 2022

Learn strategies for better measurement and test in simulation-based PCB design

A new white paper offers useful tips and techniques for PDN analysis and performance optimization in designs such as those using DDR4.

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March 4, 2022

Verification engineers look to better skills to beat schedules

A panel at DVCon argued too much of a focus on point tools coupled with challenges with interoperability and cross-industry cooperation is hindering the ability of SoC teams to design and verify complex products.

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March 2, 2022

Synopsys talks AI in verification at DVCon

Synopsys R&D vice president Manish Pandey described the ways in which the tools supplier has harnessed machine learning so far to gain speedups and improvements in coverage.

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February 10, 2022

Capturing connectivity for assembly verification in 2.5D and 3D design

Learn how to ingest data from multiple engineering teams in multiple formats on interposer and other multi-dimensional projects.

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February 8, 2022

Arm aims for IPO as Nvidia calls off its bid

Nvidia has decided to give up on acquiring Arm from SoftBank. The IP provider will now aim for an IPO by the end of March 2023.

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February 8, 2022

How digital twin evaluations optimize STCO-based design

System Technology Co-optimization raises various SI, PI, thermal, mechanical and warp risks due to its use of advanced packaging. Early-stage prototyping mitigates them.

January 25, 2022

Silicon Photonics verification case study from UC-Davis and Texas A&M

Silicon Photonics 3D integration posed LVS challenges in this fast emerging technical space. A case study describes how the two institutions overcame them.

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January 25, 2022

Choose the right advanced packaging methodology for metal fill rules

Advanced packaging requirements from foundries and OSATs pose stringent challenges. A new paper describes three ways of satisfying them.

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January 11, 2022

Airbus charts digital twin path with Capital

Siemens software will be used to accelerated the development of commercial aircraft.

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December 31, 2021

AMD moves gradually into 3D integration

At December’s Design Automation Conference, AMD senior vice president Sam Naffziger provided more insights into the chipmaker’s use of chiplet-based design and manufacture.

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