Author Archives: Chris Edwards

About Chris Edwards

Chris Edwards has spent a long time covering electronics and EDA. He is a former Editor-in-Chief of Electronic Engineering Times UK and electronics editor of the IET's Engineering & Technology. His work has appeared in a variety of international newspapers including The Guardian, The Daily Telegraph, The Age and the South China Morning Post.
September 27, 2019

Accellera adds detail to proposed security assurance model

Accellera's security assurance working group has set out some of its plans in a white paper.
Article  |  Topics: Blog - IP  |  Tags: , ,   |  Organizations:
September 18, 2019

Ceva shares weights for lower DNN overhead

Ceva has employed a more extensive form of weight compression in its latest generation of DNN processor cores.
Article  |  Topics: Blog - IP  |  Tags: , , ,   |  Organizations:
September 18, 2019

Cadence expands system analysis to thermal

Cadence has followed its launched of a parallelizable EM simulator with one that focuses on the thermal behavior of ICs through to multi-PCB assemblies.
Article  |  Topics: Blog - EDA, PCB  |  Tags: ,   |  Organizations:
September 11, 2019

Embedded design meets low-code in Siemens integration plans

Siemens is combining recent acquisitions in novel ways, including one that will see a web-app development package interact more closely with Mentor's embedded offerings.
Article  |  Topics: Blog - Embedded, PCB  |  Tags: , , , ,   |  Organizations: ,
September 10, 2019

Digital twin points the way to system-level vehicle safety

The digital-twin concept provides several avenues to achieving better safety analysis and is likely to benefit from Siemens' integration of Mentor activities.
September 5, 2019

DVCon keynotes to look at edge computing and network evolution

DVCon Europe, Accellera’s design and verification conference to be held in Munich in late October, will feature keynotes on the trends toward edge computing and the future of networks.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , ,   |  Organizations:
September 4, 2019

Future memories not so future any more

Non-volatile alternatives to flash are finally moving out of the lab as Applied Materials launches production tools and Arm starts pushing MRAM.
Article  |  Topics: Blog - Embedded, IP  |  Tags: , , , , ,   |  Organizations: , ,
September 4, 2019

IEDM homes in on connected devices

The IEDM has chosen a theme based around technologies for connected devices for its upcoming conference in December.
Article  |  Topics: Blog - EDA  |  Tags: , , ,
August 27, 2019

GlobalFoundries takes aim at TSMC’s customers in patent action

GlobalFoundries is calling for imports of chips fabbed by TSMC into the US and Germany in multiple actions based on a list of 16 patents.
Article  |  Topics: Blog - IP  |  Tags: , , , ,   |  Organizations: , , ,
August 6, 2019

Increased cooperation seen as vital for automotive safety verification

Safety verification calls for increased collaboration across the supply chain, experts say. The challenge is finding ways to make that happen.