Synopsys

November 6, 2013

Improving performance through better delay estimation of sub-32nm interconnects

Better delay estimation of sub-32nm interconnects, in which resistivity varies up to 100x between layers, helps Cavium improve overall performance and get ready for even denser processes
October 23, 2013

FPGA-based prototyping to validate the integration of IP into an SoC

A case study describing validation of the integration of USB3.0 and USB2.0 interface IP that illustrates broader challenges FPGA-based prototyping presents.
Article  |  Topics: IP - Assembly & Integration, EDA - Verification  |  Tags: , ,   |  Organizations:
September 24, 2013

Accelerating process migration in advanced ASIC design at Bull

How the HPC company used Synopsys' Lynx Design System to standardise its flow and simplify migration to the next node.
Article  |  Topics: IP - Design Management, EDA - IC Implementation  |  Tags: , , ,   |  Organizations: ,
September 17, 2013

Managing power intent, signal isolation and level shifting in a UPF-based multi-voltage IC design

Power intent, signal isolation and level shifting can all be controlled in a UPF-based multi-voltage IC design through careful coding.
Article  |  Topics: EDA - IC Implementation  |  Tags: , , , ,   |  Organizations:
September 16, 2013

Why use USB 3.0?

The first of a series of seven articles describing the key details of the USB 3.0 protocol.
Article  |  Topics: IP - Selection  |  Tags: ,   |  Organizations:
September 16, 2013

The USB 3.0 Link Layer

A look at the way in which the USB 3.0 Link Layer manages the port-to-port flow of data between the host and the device.
Article  |  Topics: IP - Assembly & Integration  |  Tags: ,   |  Organizations:
September 16, 2013

USB 3.0 system overview

An overview of the USB 3.0 architecture, covering the USB Host, USB Device(s) and USB Interconnect, as well as the related receptacles, plugs and cables.
Article  |  Topics: IP - Assembly & Integration  |  Tags: ,   |  Organizations:
September 16, 2013

USB 3.0 protocol layer – part 1

A first look at the role of the protocol layer in USB 3.0.
Article  |  Topics: IP - Assembly & Integration  |  Tags: , ,   |  Organizations:
September 16, 2013

The USB 3.0 Functional Layer

A look at the USB 3.0 functional layer, an application layer and system software on the host side, and a logical function and device on the device side.
Article  |  Topics: IP - Assembly & Integration  |  Tags: , ,   |  Organizations:
September 16, 2013

USB 3.0 protocol layer – part 2

A look at the role of four types of transaction in the USB 3.0 protocol layer: bulk, control, interrupt and isochronous.
Article  |  Topics: IP - Assembly & Integration  |  Tags: , ,   |  Organizations:

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