Dense packaging focus for ECTC
This year’s ECTC, held at the end of May, will continue its focus on the role of packaging in keeping silicon scaling on track.
HPC
Abaco adopts Covid-19 lessons for HPC design
Mil/aero specialist Abaco Systems refined its workflow across multiple design sites after the pandemic constrained collaboration.
Semidynamics adds flexible vectors to RISC-V cores
Semidynamics has released a customizable vector unit with out-of-order execution support to accompany its 64bit RISC-V processor cores.
Semidynamics pushes configurability on RISC-V core for HPC
Processor IP company will incorporate custom instructions and other changes in its superscalar core, which includes a novel memory unit for sparse matrices.
Chipletz pushes packaging design for AI, HPC and immersive use-cases
The Austin-based start-up used Siemens EDA software to deploy a cutting-edge Smart Substrate based on advanced packaging technology.