Blog Topics

May 26, 2016

Real Intent extends Meridian Constraints for untimed paths

Meridian Constraints update seeks to extend existing capabilities and address a gap not covered by other functional verification tools.
May 25, 2016

DAC 2016 preview: Mentor Graphics

An overview of the vendor's busy DAC program from panels to technical sessions to a one-to-one with Wally Rhines.
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May 25, 2016

Register tools appear ahead of DAC

Ahead of June's Design Automation Conference, Agnisys and Semifore have both released tools aimed at reducing the overhead of implementing register-rich SoCs.
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May 25, 2016

ECC crypto code and core aim for home automation

Oberon Microsystems has ported a set of low-overhead cryptographic codes suitable for Apple's HomeKit to the Cortus APS3RP 32bit processor core.
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May 24, 2016

DAC 2016 preview: Gary Smith EDA

The company's annual 'What to see' list is now available for download and highlights some of EDA's less recognized areas of innovation.
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May 23, 2016

Mentor integrates automotive IGBT test and simulation

A new dedicated automotive power tester helps cut simulation errors to just 0.5% with more faithful calibration.
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May 23, 2016

Cloud analysis comes to power grid design

Ansys has decided to marry cloud computing with some of the tools used in SoC design that can make use of large amounts of temporary computer power.
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May 18, 2016

ARM completes multicore test chip on 10nm finFET

ARM says it has received test chips designed to check how well an SoC built around a 64bit multicore Cortex v8-A processor complex would work TSMC's upcoming 10nm FinFET process technology.
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May 5, 2016

Functional safety and high reliability for FPGA designs – eight videos show you how

Videos detail techniques to improve the functional safety and reliability of FPGA designs, including the implementation of triple modular redundancy, safe FSM schemes and self monitoring.
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May 3, 2016

Allegro release tackles new generations of PCB

The latest release of Cadence's Allegro deals with flex PCBs, material inlays as well as tighter links to signal integrity.

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