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The International Electron Device Meeting has pushed back the deadline for its papers to get the latest developments in process and device design into the December conference.

SoftBank cites IoT as its main reason for buying ARM, but could it change the relationship between customers and the processor designer?

EEMBC has turned its attention to heterogeneous computing with plans to create a new set of benchmarks.

Mentor Graphics has added four new units to its PADS PCB family addressing increasing complexity in mainstream design.

DTCO work by GlobalFoundries and Qualcomm reported at VLSI Symposia shows the need to minimize fin counts in future finFET processes.

“It’s the time between putting out an open-source ARM core and getting a letter from an ARM lawyer,” says UC Berkeley professor Krste Asanovic. So, some design teams are turning to IP that started out as open source to provide more scope for experimentation.

Electrical analysis facility does RC extraction on virtual fab models, accelerating the availability of early PDKs for new processes

Design for test could look quite different in five years' time compared to the situation designers have today as chipmakers wrestle with the problems of yield control, safety, and aging.

Researchers at the Georgia Institute of Technology adapted conventional 2D layout tools to a two-layer monolithic 3D process that resulted in sizeable space and power savings.

Deep pipelines and dynamic memory sharing may provide the key to the development of faster and more efficient server-farm blades as the focus in hardware design moves to augmenting conventional processors with specialized accelerators.