Siemens

June 30, 2022

Siemens and Nvidia aim to bring more virtual reality to digital twins

Siemens and Nvidia have agreed to work more closely together to drive the development of higher-fidelity digital twins.
Article  |  Topics: Blog - EDA, Embedded  |  Tags: , ,   |  Organizations: ,
December 4, 2020

Analog surges as cause of IC respins (Wilson Functional Verification 2020 – Part Three)

Study may point to new challenges in more bidirectional AMS implementations on SoC-class designs, though formal and emulation help keep respin count in check.
December 1, 2020

Less than one-in-five FPGA projects avoid bug escapes (Wilson Functional Verification 2020 – Part Two)

Benchmark study detects correlation between maturity of verification processes and the quality of designs when they reach production.
November 27, 2020

RISC-V in nearly a quarter of designs (Wilson Functional Verification 2020 – Part One)

Use of the open-source RISC-V processor was tracked for the first time by the biennial study, finding notably high take-up.
November 3, 2020

Showing ‘equivalence’ to seed digital twin adoption

A partnership between Siemens and VSI, a real-world autonomous vehicle research company, aims to refine and promote digital twin strategies.
Article  |  Topics: Digital Twin, Verification  |  Tags: , , , , , , ,   |  Organizations:
August 27, 2020

Automotive E/E design demands a multi-domain, system-led approach

Increasing complexity means that teams must leverage automation to work across disciplines, speed delivery and free room for innovation.
March 27, 2020

The 10 ways to automate increasingly complex wire harness design

Wire harness implementations already face tough margins and increasing design pressure from markets such as automotive. Here's how tools can help.
Article  |  Topics: Digital Twin, Blog - Electrical Design  |  Tags: , ,   |  Organizations:
January 7, 2020

Siemens and Arm combine to extend digital twin further into SoC design

Partnership combines Siemens PAVE 360 digital twin with ARM IP, including dedicated automotive offerings, to speed and streamline design toward Level 5.
Article  |  Topics: Digital Twin, Blog - EDA, IP, PCB  |  Tags: , , , ,   |  Organizations: , ,
September 11, 2019

Embedded design meets low-code in Siemens integration plans

Siemens is combining recent acquisitions in novel ways, including one that will see a web-app development package interact more closely with Mentor's embedded offerings.
Article  |  Topics: Blog - Embedded, PCB  |  Tags: , , , ,   |  Organizations: ,
September 10, 2019

Digital twin points the way to system-level vehicle safety

The digital-twin concept provides several avenues to achieving better safety analysis and is likely to benefit from Siemens' integration of Mentor activities.

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