Archives

March 19, 2013

DATE: Mobile phone to drive Internet of Things MEMS wave

The Internet of Things will drive the next phase for MEMS, greatly helped by a change in the way that the mobile phone interacts with its environment, says Benedetto Vigna of STMicroelectronics.
Article  |  Topics: Blog - Embedded  |  Tags: , , ,   |  Organizations:
March 18, 2013

Flotherm release moves thermal planning to concept stage

Mentor Graphics has release a version of its Flotherm tool that makes it possible to build accurate models of heat flow through electronic systems from initial concepts through to prototypes without the extensive manual rework that these analyses have needed traditionally.
Article  |  Topics: Blog - PCB  |  Tags: ,   |  Organizations:
March 11, 2013

Cadence to buy Tensilica

Cadence Design Systems has announced on the eve of CDNLive Silicon Valley that it has decided to buy configurable-processor company Tensilica for approximately $380m in cash.
Article  |  Topics: Blog - EDA  |  Tags: , ,   |  Organizations:
March 11, 2013

RF boards go open source

Lime Microsystems has decided to join the open-source hardware movement in the hope of building an RF analog of the Arduino.
Article  |  Topics: Blog - PCB  |  Tags: , ,   |  Organizations:
March 7, 2013

Tanner embraces OpenAccess

Tanner EDA has completed the port of its HiPer Silicon design suite to work with the OpenAccess database, providing better interoperability with foundry process design kits (PDKs) and with other vendors’ IC design tools as well as providing better support for multiple users accessing the same design.
Article  |  Topics: Blog - EDA  |  Tags: , ,   |  Organizations:
February 26, 2013

Intel foundry to make Altera FPGAs

Intel's announcement that it will make FPGAs for Altera in an upcoming 14nm finFET process will reshape the programmable logic, and foundry, businesses.
Article  |  Topics: Blog Topics, General  |  Tags: , ,   |  Organizations: ,
February 23, 2013

Parallel API for embedded systems goes public

The Multicore Association has published the MTAPI specification for a programming interface that aims to simplify the job of building applications that can not only use many cores running in parallel but schedule jobs dynamically depending on which types of core are available.
Article  |  Topics: Blog - Embedded  |  Tags: , , ,   |  Organizations:
February 21, 2013

ISSCC 2013: AMD constraints help tame Jaguar

Some conservative decisions were important parts of AMD's design strategy for the 28nm core that's just been specified in PlayStation 4
Article  |  Topics: Blog - EDA, - Verification  |  Tags: , ,   |  Organizations:
February 20, 2013

ISSCC 2013: IBM adds digital logic synthesis methodology for System z

The paper on the 32nm upgrade to Big Blue's family of server chips also detailed how the company is tackling BTI.
Article  |  Topics: Conferences  |  Tags: ,   |  Organizations:
February 19, 2013

ISSCC 2013: Silicon and organic stacks for prosthesis

TSVs and layers of organic electronics provide two ways to build medical sensors and prosthetics, as shown at ISSCC 2013.