Tech Design Forum
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prosthetics
prosthetics
February 19, 2013
ISSCC 2013: Silicon and organic stacks for prosthesis
TSVs and layers of organic electronics provide two ways to build medical sensors and prosthetics, as shown at ISSCC 2013.
Article | Topics:
Blog - EDA
| Tags:
ISSCC 2013
,
medical electronics
,
organic electronics
,
prosthetics
,
TSV
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