CEA-Leti has launched a design center called Silicon Impulse with the intention of lowering the entry barrier to using the FD-SOI process.
Research by the University of Michigan into subthreshold circuit design has led to spinoff company Ambiq Micro creating a family of microcontrollers that it claims provide an ARM Cortex-M4F with power consumption at levels normally associated with an M0+.
A multiprocessor test chip has led ARM to improve the energy-control strategy for its Big.Little architecture and to simplify the debug architecture for the company's multicore processor IP.
ARM is making a free operating system a cornerstone of its push into selling both more cores and server software to help manage them.
Does the internet of things (IoT) require a change in design techniques? A number of people involved in the EDA industry reckon it does.
TSMC has launched three processes the foundry is aiming at internet-of-things (IoT) and wearable-device designs, providing lower-leakage versions of its 55nm, 40nm and 28nm processes.
Chris Rowen, CTO of the IP group at Cadence Design Systems, expects the internet of things (IoT) to cause a split in approaches to SoC design, one of a set of predictions about the nascent market.
ARM is working on a heavily multithreaded version of its processor core to see if it can provide a more convenient alternative to GPUs.
The International Energy Agency (IEA) has turned its attention to slashing the electricity demands of network-attached devices with a report that says manufacturers and service providers need to look at changes to protocols and features such as energy harvesting.
Glass may be the high frequency interposer option given silicon concerns about power and noise. TSMC adds another pathfinder to its 3D arsenal.
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