About Chris Edwards
Chris Edwards has spent a long time covering electronics and EDA. He is a former Editor-in-Chief of Electronic Engineering Times UK and electronics editor of the IET's Engineering & Technology. His work has appeared in a variety of international newspapers including The Guardian, The Daily Telegraph, The Age and the South China Morning Post.
August 6, 2012
If you were to dramatize the situation for extreme ultraviolet (EUV) as the next-generation lithography technology for chipmaking as a movie, it would by now be in the difficult third act. Having been through many ups and downs, it’s now lying on a hospital bed and it’s not clear whether the slowing pulse will flatline […]
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August 6, 2012
The president and co-CEO of Synopsys provides his take on the mounting influence of software and physical effects in the creation of SoCs.
August 3, 2012
Synopsys is to acquire SpringSoft, expanding its custom-IC tool base and letting it fold debug into its existing HDL flow.
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July 26, 2012
Xilinx says it has made the first public release of its Vivado Design Suite – the reworked design environment for its sub-40mn programmable-logic devices that is based more heavily on concepts from the custom-IC world than its existing ISE toolset.
July 4, 2012
Cadence Design Systems has purchased Sigrity, the specialist in signal and power integrity, in a deal worth approximately $80m, to extend its IC packaging, PCB and IP portfolio.
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June 22, 2012
Analog Devices has helped developed a new version of TSMC's 180nm BCD process for analog and mixed-signal circuits that slashes noise tenfold compared with the original version released in 2009.
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June 20, 2012
Atrenta has taken a step into functional verification with the decision to buy NextOp Software, a specialist in assertion synthesis.
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June 14, 2012
A day ahead of Intel's VLSI Technology Symposium paper on its 22nm finFET process, a group led by IBM set out to show that silicon-on-insulator (SOI) devices could do as well not only on low-power, where SOI has traditionally had the edge, but high-performance circuits.
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June 14, 2012
Texas Instruments had good news for teams that want to assemble 3DIC stacks using thru-silicon vias (TSVs). The stress induced by the copper TSVs is not as bad as many feared for nanometer-scale transistors.
June 13, 2012
MEMS relay-based devices offer the ultimate in subthreshold leakage: they don't have any. Design and technology advances are promising to overcome problems with reliability, design and speed, according to Tsu-Jae King Liu of UC Berkeley.