Blog Topics

September 18, 2019

Cadence expands system analysis to thermal

Cadence has followed its launched of a parallelizable EM simulator with one that focuses on the thermal behavior of ICs through to multi-PCB assemblies.
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September 11, 2019

Embedded design meets low-code in Siemens integration plans

Siemens is combining recent acquisitions in novel ways, including one that will see a web-app development package interact more closely with Mentor's embedded offerings.
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September 10, 2019

Digital twin points the way to system-level vehicle safety

The digital-twin concept provides several avenues to achieving better safety analysis and is likely to benefit from Siemens' integration of Mentor activities.
September 5, 2019

DVCon keynotes to look at edge computing and network evolution

DVCon Europe, Accellera’s design and verification conference to be held in Munich in late October, will feature keynotes on the trends toward edge computing and the future of networks.
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September 4, 2019

Future memories not so future any more

Non-volatile alternatives to flash are finally moving out of the lab as Applied Materials launches production tools and Arm starts pushing MRAM.
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September 4, 2019

IEDM homes in on connected devices

The IEDM has chosen a theme based around technologies for connected devices for its upcoming conference in December.
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September 3, 2019
Joe Sawicki, EVP for IC EDA, Mentor. 'AI inside' analysis

EDA with ‘AI inside’ – Mentor’s Joe Sawicki offers an insider’s view

Mentor has a host of tools - some public, some not - that leverage AI and ML. EVP Joe Sawicki has been describing the strategy behind their development.
September 2, 2019

South Korea-Japan tensions continue to threaten memory supply chain

Concerns that the diplomatic stand-off between Seoul and Tokyo could hit the supply chain rose again this weekend as South Korean politicians made a surprise visit to disputed islands.
August 27, 2019

GlobalFoundries takes aim at TSMC’s customers in patent action

GlobalFoundries is calling for imports of chips fabbed by TSMC into the US and Germany in multiple actions based on a list of 16 patents.
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August 23, 2019

Making the case for HLS in autonomous drive

The automotive market faces challenges that make it a prime candidate for the greater use of high-level synthesis on designs with AI and ML content.

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