Blog Topics

Harness manufacture in automotive remains manually intensive but model-based engineering provides a way to streamline the processes to make them more efficient, a Mentor white paper claims.

Ceva has employed a more extensive form of weight compression in its latest generation of DNN processor cores.

IP core focuses on avodiing memory access bottlenecks during processing of complex machine-learning and artificial-intelligence algortihms.

Cadence has followed its launched of a parallelizable EM simulator with one that focuses on the thermal behavior of ICs through to multi-PCB assemblies.

Siemens is combining recent acquisitions in novel ways, including one that will see a web-app development package interact more closely with Mentor's embedded offerings.

The digital-twin concept provides several avenues to achieving better safety analysis and is likely to benefit from Siemens' integration of Mentor activities.

DVCon Europe, Accellera’s design and verification conference to be held in Munich in late October, will feature keynotes on the trends toward edge computing and the future of networks.

Non-volatile alternatives to flash are finally moving out of the lab as Applied Materials launches production tools and Arm starts pushing MRAM.

The IEDM has chosen a theme based around technologies for connected devices for its upcoming conference in December.

Mentor has a host of tools - some public, some not - that leverage AI and ML. EVP Joe Sawicki has been describing the strategy behind their development.