14nm/16nm

FinFET processes and libraries are maturing, enabling designers to explore the best ways to take advantage of the capabilities of the new transistor design

The 10nm process node calls for the use of SOCV techniques during timing signoff to avoid leaving too much performance on the table.

The 10nm process will see changes to multiple patterning that demands changes in the implementation flow, along with an increased focus on the effects of variability.

In sessions at the 2015 Design Automation Conference, engineers who had worked on finFET-oriented projects revealed how the technology has changed their design practices and where others may want to think twice about making the move.

ARM has revealed a number of details of the microarchitecture that underpins its flagship Cortex-A72 as the processor moves towards its production release.

ARM and TSMC used an extensive pre-planning process, including a static analysis of each module's overall logic structure, to put together a 2.3GHz processor design based around ARM's main 64bit Big.Little pairing for the foundry's 16nm finFET process.

How EDA tools are evolving to make it possible to design with finFET processes.

FinFET and 3DIC technologies bring with them not just higher performance but an increased need for accurate parasitic analysis.

Advanced tools are being applied to established nodes to produce advanced designs for volume markets.

If EUV is further delayed until 8nm, the industry has to explore other options for patterning, and the effects they will have on the DFM flow.