Archives

August 15, 2016

SystemC materials move to Apache 2.0 license

Accellera has moved to an Apache 2.0 open-source license for all of the supplementary materials for its SystemC library.
Article  |  Topics: Blog - EDA, IP  |  Tags: ,   |  Organizations:
August 12, 2016

Chinese dates set for Asia-Pacific editions of Mentor Forum

Wally Rhines headlines as keynote at free technical events set for Shanghai on August 30 and Beijing on September 1.
Article  |  Topics: Conferences, Blog - EDA, Embedded, PCB  |  Tags: , ,   |  Organizations:
July 26, 2016

Cadence adds floating point to Fusion

Cadence Design Systems has added floating-point to its latest core intended for embedded signal processing.
Article  |  Topics: Blog - Embedded, IP  |  Tags: , ,   |  Organizations:
July 22, 2016

IEDM alters schedule to keep abreast of process updates

The International Electron Device Meeting has pushed back the deadline for its papers to get the latest developments in process and device design into the December conference.
Article  |  Topics: Blog - EDA  |  Tags: , , ,   |  Organizations:
July 12, 2016

EEMBC looks into heterogeneous compute

EEMBC has turned its attention to heterogeneous computing with plans to create a new set of benchmarks.
Article  |  Topics: Blog - Embedded  |  Tags: , , ,   |  Organizations:
July 11, 2016

Mentor’s PADS family extended for AMS, DDR and electrical DRC

Mentor Graphics has added four new units to its PADS PCB family addressing increasing complexity in mainstream design.
Article  |  Topics: Blog - PCB, - Product  |  Tags: , , , , , , ,   |  Organizations:
June 10, 2016

RC extraction from ‘virtual fab’ models may speed PDK availability

Electrical analysis facility does RC extraction on virtual fab models, accelerating the availability of early PDKs for new processes
Article  |  Topics: Conferences, Blog - EDA  |  Tags: , ,   |  Organizations:
June 9, 2016

2D tools adapt to create smaller monolithic 3DIC designs

Researchers at the Georgia Institute of Technology adapted conventional 2D layout tools to a two-layer monolithic 3D process that resulted in sizeable space and power savings.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , ,   |  Organizations:
June 7, 2016

ARM accelerates POP deployment for Cortex-A73

A faster implementation program for the POP support IP for ARM's cores has delivered a 16nm finFET package for the Cortex-A73 shortly after the core's Computex launch.
Article  |  Topics: Blog - EDA, IP  |  Tags: , ,   |  Organizations:
June 7, 2016

Analyzer merges constraints for multiple timing modes

Ausdia has launched a product intended to reconcile the multiple sets of timing constraints needed for operating and test modes so that a consistent group of constraints can be fed to implementation tools.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations: