DFM

May 31, 2011

Full Chip Correction of EUV Design

Extreme Ultraviolet Lithography (EUVL) is currently the most promising technology for advanced manufacturing nodes: it recently demonstrated the feasibility of 32nm and 22nm node devices, and pre-production tools are expected to be delivered by 2010. Generally speaking, EUVL is less in need of Optical Proximity Correction (OPC) as compared to 193nm lithography, and the device […]

Whitepaper  |  Tags: , ,
May 31, 2011

The Roadmap to LFD Value: Quantifying a Return on Investment in Calibre LFD

By the time a serious lithographic problem is identified at the fab, it is too late in the design process to make a simple layout change, resulting in a significant delay of the tapeout, and consequently chip delivery. To diminish the risk of sensitive layout structures, and avoid or reduce design delays, designers need the […]

May 31, 2011

Demonstrating the Benefits of Source-Mask Optimization and Enabling Technologies through Experiment and Simulations

In recent years the potential of Source-Mask Optimization (SMO) as an enabling technology for 22nm-and-beyond lithography has been explored and documented in the literature.1-5 It has been shown that intensive optimization of the fundamental degrees of freedom in the optical system allows for the creation of non-intuitive solutions in both the mask and the source, […]

Whitepaper  |  Tags: , ,
May 31, 2011

Deployment of OASIS in the Semiconductor Industry – Status, Dependencies and Outlook

The OASIS working group was first initiated in 2001, published the new format in March 2004, which was ratified as an official SEMI standard in September 2005. A follow-on initiative expanded the new standard to cover the needs of the mask manufacturing equipment sector with a derived standard called OASIS.MASK (P44) that was released in […]

Whitepaper  |  Tags: , ,
May 31, 2011

Computational Lithography: Enabling 12 Technology Nodes in 12 years

Computational lithography has become an integral part of design since the 130nm process node. New techniques continue to be developed to extend the steady node shrink year after year.

Whitepaper  |  Tags: , ,
May 31, 2011

Generalization of Shot Definition for Variable Shaped E-Beam Machines for Write Time Reduction

By adding a second deflector-aperture stage to the electron beam column of a vector shaped mask writer in which the aperture has the shape of a cross, one gains the ability to print a parameterized “L-shaped” exposure. This is the most modest generalization of the shot shape in such machines that retains the current paradigm […]

Whitepaper  |  Tags: , ,
May 31, 2011

Optimize the OPC Control Recipe With Cost Function

With rapidly shrinking feature sizes, full chip robust Optical Proximity Correction (OPC) will take longer due to the increasing pattern density. Furthermore, to achieve a perfect OPC control recipe becomes more difficult. The critical dimension of the design features is smaller than the exposure wavelength, and there is only limited room for the OPC correction. […]

Whitepaper  |  Tags: , ,
May 31, 2011

OPC Recipe Optimization Using Simulated Annealing

One of the major problems in the RET flow is OPC recipe creation. The existence of numerous parameters to tune and the interdependence between them complicates the process of recipe optimization and makes it very tedious. There is usually no standard methodology to choose the initial values for the recipe settings or to determine stable […]

Whitepaper  |  Tags: , ,
May 31, 2011

An Optimized OPC and MDP Flow for Reducing Mask Write Time and Mask Cost

During optical proximity correction (OPC), layout edges or fragments are migrated to proper positions in order to minimize edge placement error (EPE). During this fragment migration, several factors other than EPE are a part of the cost function for optimal fragment displacement. Several factors are devised in favor of OPC stability, which can accommodate room […]

Whitepaper  |  Tags: , ,
February 25, 2011

The fundamental question

Nanotechnology's economic potential will only be harnessed through more basic research, according to a new report from the NSF. Paul Dempsey reports.
Article  |  Tags:

PLATINUM SPONSORS

Synopsys Cadence Design Systems Mentor - A Siemens Business
View All Sponsors