Tech Design Forums
Technique
microbump
microbump
All
(2)
Articles
(1)
Guides
(1)
December 12, 2012
Enabling 3D-IC design
Meeting the challenges of moving beyond planar integration to side by side, and eventually truly stacked, dice, for designers, tool vendors and the supply chain.
Article | Topics:
EDA - IC Implementation
| Tags:
2.5DIC
,
3DIC
,
microbump
,
TSV
| Organizations:
Synopsys
,
Xilinx
August 21, 2012
2.5D-IC, 3D-IC, and 5.5D-IC – stacked-die integration
A guide to emerging 3D integration techniques for ICs, including a look at various approaches, and some of the tools and standards issues involved.
Guide | Topics:
EDA - DFM
| Tags:
2.5DIC
,
3DIC
,
5.5DIC
,
microbump
,
silicon interposer
,
standards
,
thermal management
,
TSV
EDA Topics
DFM
DFT
ESL
IC Implementation
Verification
PLATINUM SPONSORS
View All Sponsors
twitter
facebook
RSS
Tech Design Forum
Log In
Register
Sponsors
Briefing
EDA
EDA TOPICS
DFM
DFT
ESL
IC Implementation
Verification
MORE EDA
Expert Insights
Guides
EDA Home Page
IP
IP TOPICS
Assembly & Integration
Design Management
Selection
MORE IP
Expert Insights
Guides
IP Home Page
PCB
PCB TOPICS
Design Integrity
Layout & Routing
System Codesign
MORE PCB
Expert Insights
Guides
PCB Home Page
Embedded
EMBEDDED TOPICS
Architecture & Design
Integration & Debug
Platforms
User Experience
MORE EMBEDDED
Expert Insights
Guides
Embedded Home Page
Search