EDA

October 29, 2013

ARM launches communities and asks for IoT ideas

ARM has launched at TechCon its own crop of online forums intended to let engineers collaborate and share ideas and has asked for IoT ideas.
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October 22, 2013

Memory gets smarter for network speedups

Memoir Systems has developed a set of memory controller IP cores that exploit common access patterns used by processors in network switches to improve performance and power consumption
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October 16, 2013

CDNLive calls out for papers

Cadence Design Systems has issued a call for papers for the European leg of its CDNLive of events for 2014. The deadline for the Silicon Valley event is also looming: the call closes mid-November 2013.
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October 11, 2013

Verification Futures rolls out in Europe next month

The one-day conference series features the latest innovations from many verification vendors in separate UK, France and Germany editions.
October 10, 2013

Cadence launches IP cores for 60GHz wireless and consumer audio

Cadence Design Systems has launched IP cores for high-end mobile audio as well as gigasample ADCs for 28nm to support 60GHz wireless.
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October 10, 2013

Help preserve EDA’s slice of electronics history

There's still time - just - to reserve your place at EDAC's Back To the Future dinner and auction to raise funds to mark EDA's contribution to our business at the Computer History Museum.
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October 9, 2013

Cadence parallelizes FastSpice for large-scale mixed-signal checks

Cadence Design Systems has developed a version of its Spectre FastSpice tool that splits simulation across many computers without manually cutting the design into segments.
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October 8, 2013

Wreal and Open Access star in mixed-signal summit

Real-value modelling and flows using the Open Access database will be among the focus topics of Cadence's Mixed-Signal Technology Summit on 10 October.
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October 4, 2013

eSilicon delivers free MPW quote tool

Design services company eSilicon has made freely available a tool it developed to streamline ordering for multi-project wafer (MPW) ‘shuttle’ services.
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October 4, 2013

Design kit for 10nm FD-SOI due out next year

Research group CEA-Leti expects to have design kits ready for a 10nm FD-SOI process in June 2014
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