IC Implementation

Many design teams are looking at ways in which they can make use of 3D integration. Here are eight requirements for an effective 3D-IC design flow.

The arrival of the 20nm and finFET-based 14nm and 16nm processes bring with them challenges for custom IC design. These are the five key areas and a methodology that can address them.

2.5D-IC integration overcomes 2D limitations such as cost, offchip bandwidth bottlenecks and I/O pin scarcity, and offers a route to true 3D-IC integration.

It’s time to take up the challenge of applying 3D integration technology to IC design. The manufacturing process technology is maturing, the tool chains are in place, and the opportunities to broaden your market by applying a new form of systemic integration are growing.

The chipmaker used Calypto’s PowerPro to carry out power analysis of its latest core design at the RTL rather than at post-gate synthesis.

Meeting the challenges of moving beyond planar integration to side by side, and eventually truly stacked, dice, for designers, tool vendors and the supply chain.

Using hierarchy and improved constraints management to accelerate static timing analysis at 20nm and below.

CSR used a customized approach to automated dummy fill layout for AMS to address layer density and device matching issues in standard flows aimed at digital SoCs.

The advantages and challenges of 3D IC integration, as we add vertical functional integration options to the traditional planar integration brought by the progress of Moore's Law.

The FPGA vendor's new flagship is now on public release. It adds an array of features, including support for system-level to HDL synthesis.