advanced packaging

January 19, 2023
Connectivity Management Feature - Jan 23

Putting it all together to accelerate 3D IC design

Learn how connectivity management solutions help you manage the multiple formats in which 3D IC components are delivered.
January 13, 2022

Siemens’ Sawicki puts priority on scaling in processes, productivity and systems

More optimistic about the semiconductor industries prospects than for some time, Siemens Joe Sawicki identified key EDA challenges at DAC.
September 23, 2015

Mounting Fiji: How AMD realized the first volume interposer

AMD's Radeon R9 family is the result of eight years developing 3D-IC and interposer technology. What lessons did the company learn?
Article  |  Topics: EDA - DFM, DFT, IC Implementation  |  Tags: , , , , , , ,   |  Organizations: , , , ,
July 25, 2014
Bundles help group signals on package pinouts

Multi-fabric planning for more efficient PCB design

A coordinated design methodology fine-tunes chip-to-package PCB layout and routing that involves high-integration devices.
June 10, 2014
High-speed I/O eye diagram - thumbnail

Zeroing in on the problems of fast board-level interconnect

A panel session at DAC 2014 focused on the problems of high-speed, board-level interconnect and the roles of codesign and power integrity in solving them.

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