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July 25, 2014
Multi-fabric planning for more efficient PCB design
A coordinated design methodology fine-tunes chip-to-package PCB layout and routing that involves high-integration devices.
Article | Topics:
PCB - Layout & Routing
,
System Codesign
| Tags:
advanced packaging
,
BGA
,
design rules (PCB)
,
multi-fabric
,
PCB place and route
| Organizations:
Cadence Design Systems
PCB Topics
Design Integrity
Layout & Routing
System Codesign
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