Collaboration let HiSilicon accelerate 16nm finFET plans
HiSilicon claims close collaboration with foundry and EDA tools partners helped speed up plans to tape out the first 16nm finFET-based design through TSMC.
networking
Avago and Broadcom: integration of another kind?
Last week's announcement by Avago that it would buy Broadcom looks to be only partly about bulk. The merger could help drive SIP and 3DIC integration.
All aboard the IoT starter kit bandwagon
A variety of organizations used Embedded World to introduce kits to attract a broader base of developers looking at Internet of Things (IoT) applications.
HCC adds web, mail, time services to ‘reliable’ network stack and extends flash support
HCC Embedded has extended the TCP/IP stack the company wrote using MISRA rules and formalized V-model processes to include web server, mail, time, and network management protocols.