Blog Topics

April 30, 2012

New England User2User puts emphasis on board-level design and verification

Mentor Graphics' user event includes insights on constraints-driven design and the emerging OVM verification methodology in an eye-catching program.
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April 25, 2012

No more spaghetti

Cutting the cabling to simplify the emulation process.
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April 17, 2012

SpringSoft tackles analog automation with new twist on constraints

SpringSoft is trying a different approach to constraint-based design in a bid to improve the automation of custom and mixed-signal design, particularly on advanced process nodes.
April 13, 2012

U2U notebook: five sources of EDA growth… and golf clubs

Mentor Graphics' CEO Wally Rhines picked out the trends he says can boost design productivity and drive growth for tools vendors at the company's Silicon Valley User2User conference
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April 5, 2012

U2U links test and yield enhancement

Subtle data correlation and analysis techniques are helping to relate logic failures to particular types of manufacturing defect.
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April 5, 2012

U2U to assess state of 3DIC flow

Qualcomm's director of engineering is among the panelists at the upcoming U2U event in Santa Clara who will look at the state of play for 3DICs and how design flows are bearing up to dealing with 3D integration.
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April 2, 2012

Mixed-signal for the rest of us from Triad

The specialist AMS foundry Triad Semiconductor has married its ViaASIC drag and drop libraries to Mentor Graphics' SystemVision design environment.
March 28, 2012

SNUG 2012 notebook: Critical mass takes ever more collaboration

Companies need to collaborate with partners, vendors, and the rest of the supply chain if they are to achieve critical mass, Aart de Geus tells Synopsys user meeting.
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March 27, 2012

Yocto Project gets a useful shove from Mentor

The Yocto Project brings the 'ecosystem' concept to embedded Linux and the tool vendor's launch builds that idea out nicely.
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March 26, 2012

Synopsys builds 3D into tool portfolio

At the SNUG event this week, Synopsys is taking the wraps off its plans to support 3DIC, with updates to tools for physical design and verification.