EDA

February 5, 2013

Using VIP for cache coherency hardware implementations

Cache coherency implemented in hardware increases the verification effort. VIP-based strategies are described with particular reference to ARM protocols.
Article  |  Topics: EDA - Verification  |  Tags: , ,   |  Organizations: ,
January 31, 2013
Balance image for Cadence AVIP article

Accelerated VIP solves firmware and driver integration and validation tradeoffs

Trying to balance your use of simulation and FPGA prototyping is tough. Acceleration used with Accelerated VIP offers simulation-like visibility and debug with near FPGA performance.
January 24, 2013
Neill Mullinger, group marketing manager for VIP, Synopsys

Verification IP: the questions you should ask

How should you quiz your verification IP vendor to get the right VIP for your needs? Synopsys' Neill Mullinger details a checklist of the key points to raise.
Expert Insight  |  Topics: EDA - Verification  |  Tags: ,   |  Organizations:
January 18, 2013

Get more out of system architectures

This case study shows how the evaluation of various design options requires a thorough approach to system-level modeling.
Article  |  Topics: EDA - ESL  |  Tags: ,   |  Organizations:
December 12, 2012
Xilinx 3D-IC interposer featured image

Enabling 3D-IC design

Meeting the challenges of moving beyond planar integration to side by side, and eventually truly stacked, dice, for designers, tool vendors and the supply chain.
Article  |  Topics: EDA - IC Implementation  |  Tags: , , ,   |  Organizations: ,
December 6, 2012

20nm timing analysis – a practical and scalable approach

Using hierarchy and improved constraints management to accelerate static timing analysis at 20nm and below.
Article  |  Topics: EDA Topics, EDA - IC Implementation  |  Tags: , , , ,   |  Organizations:
December 4, 2012
Dr David M Fried is Chief Technology Officer - Semiconductor at Coventor, responsible for the company’s strategic direction and implementation of its SEMulator3D Virtual Fabrication Platform.

FinFET tipsheet for IEDM

finFETs are vital to the next generation of CMOS processes from Intel, TSMC and others. How will process issues including bulk vs SOI substrates, density limitations, thickness control, and planar device integration affect their practical implementation?
Expert Insight  |  Topics: EDA - DFM  |  Tags: , , , , , , , , ,   |  Organizations:
December 3, 2012

Overcoming dummy fill deck limitations for analog design

CSR used a customized approach to automated dummy fill layout for AMS to address layer density and device matching issues in standard flows aimed at digital SoCs.
Article  |  Topics: EDA - DFM, IC Implementation  |  Tags: , ,   |  Organizations: ,
November 27, 2012
LTTng logo

How LTTng enables complex multicore system development

The Linux Trace Tookit next generation provides open source tracer technology that helps surmount debug and optimization challenges
Article  |  Topics: Embedded - Integration & Debug  |  Tags: , , ,   |  Organizations: ,
November 16, 2012
Synopsys Virtualizer screen shot

The Shift Left: how virtual prototyping reduces risk

The business case behind how virtual prototyping speeds development, improves hardware and software quality, and improves ROI.

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