In the absence of EUV lithography, the primary option for manufacturing on a 10nm process is to extend double patterning. But the options each have issues.
It is not just a choice between EUV and multiple patterning for future nodes, but even between varieties of multi-mask technologies. How will you decide?
The costs of advanced lithography techniques at 1xnm, and the yield and reliability risks from the resultant process variation, will stop many companies getting the typical economic advantages of scaling.
Double patterning provides an alternative to using EUV lithography – making it possible to implement ICs on sub-28nm processes.
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